Invention Grant
- Patent Title: Bipolar junction transistor (BJT) with 3D wrap around emitter
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Application No.: US16362040Application Date: 2019-03-22
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Publication No.: US10734490B1Publication Date: 2020-08-04
- Inventor: Choonghyun Lee , Injo Ok , Shogo Mochizuki , Soon-Cheon Seo
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Michael J. Chang, LLC
- Agent Vazken Alexanian
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/423 ; H01L21/768 ; H01L21/265 ; H01L21/225 ; H01L29/737 ; H01L29/08 ; H01L29/10 ; H01L21/02 ; H01L29/66 ; H01L29/165

Abstract:
BJT devices with 3D wrap around emitter are provided. In one aspect, a method of forming a BJT device includes: forming a substrate including a first doped layer having a dopant concentration of from about 1×1020 at. % to about 5×1020 at. % and ranges therebetween, and a second doped layer having a dopant concentration of from about 1×1015 at. % to about 1×1018 at. % and ranges therebetween, wherein the first and second doped layers form a collector; patterning a fin(s) in the substrate; forming bottom spacers at a bottom of the fin(s); forming a base(s) that wraps around the fin(s); forming an emitter(s) that wraps around the base(s); and forming sidewall spacers alongside the emitter(s). A BJT device is also provided.
Information query
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