Invention Grant
- Patent Title: Method of operating a semiconductor device having a desaturation channel structure and related methods of manufacture
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Application No.: US16286280Application Date: 2019-02-26
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Publication No.: US10734507B2Publication Date: 2020-08-04
- Inventor: Johannes Georg Laven , Hans-Joachim Schulze
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/66 ; H03K17/041 ; H01L29/10 ; H03K3/012 ; H03K17/60 ; H01L21/225 ; H01L21/266 ; H01L21/28 ; H01L27/088 ; H01L29/06 ; H01L29/423 ; H03K17/567

Abstract:
A semiconductor device includes a first IGBT cell having a second-type doped drift zone and a desaturation semiconductor structure for desaturating a charge carrier concentration in the first IGBT cell. The desaturation semiconductor structure includes a first-type doped region forming a pn-junction with the drift zone and two trenches arranged in the first-type doped region and arranged beside the first IGBT cell in a lateral direction. The two trenches confine a mesa region including a first-type doped desaturation channel region and a first-type doped body region at least in the lateral direction. The desaturation channel region and the body region adjoin each other, and the desaturation channel region is a depletable region. Related methods of manufacture are also described.
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