Invention Grant
- Patent Title: Method of manufacturing wiring board, wiring board, and light emitting device using the wiring board
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Application No.: US15599555Application Date: 2017-05-19
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Publication No.: US10734561B2Publication Date: 2020-08-04
- Inventor: Yukitoshi Marutani
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Mori & Ward, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5acc72a3
- Main IPC: H01L33/64
- IPC: H01L33/64 ; H01L25/075 ; H05K1/18 ; H05K3/10 ; H05K1/11 ; H01L33/62 ; H05K3/20
Abstract:
A method of manufacturing a wiring board includes: providing an insulating member that includes a plurality of regions partitioned by partitions provided with openings at each of which adjacent ones of the regions are joined to each other; disposing conductive members respectively in the plurality of regions; and joining adjacent ones of the conductive members through one of the partitions to each other at the opening of the partition.
Public/Granted literature
- US20170338392A1 METHOD OF MANUFACTURING WIRING BOARD, WIRING BOARD, AND LIGHT EMITTING DEVICE USING THE WIRING BOARD Public/Granted day:2017-11-23
Information query
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