- Patent Title: Composite electronic component and manufacturing method of the same
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Application No.: US15728104Application Date: 2017-10-09
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Publication No.: US10734790B2Publication Date: 2020-08-04
- Inventor: Hye Hun Park , Kwang Jik Lee , Ju Hwan Yang , Jung Wook Seo , Sang Moon Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6cad77a4
- Main IPC: H01T4/02
- IPC: H01T4/02 ; H01T21/00 ; H01T4/08 ; H01T4/12 ; H01L27/02

Abstract:
A composite electronic component includes an element part and an electrostatic discharge (ESD) protection part disposed on the element part. The ESD protection part includes first and second discharge electrodes having a gap formed therebetween, a discharge layer disposed between the first and second discharge electrodes and in the gap, and a multilayer insulating layer covering the discharge layer and including at least two insulating layers having different breakdown voltage (BDV) values.
Public/Granted literature
- US20180175591A1 COMPOSITE ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2018-06-21
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