Invention Grant
- Patent Title: MEMS microphone and method of manufacturing the same
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Application No.: US16127897Application Date: 2018-09-11
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Publication No.: US10735867B2Publication Date: 2020-08-04
- Inventor: Dae Young Kim , Jong Won Sun
- Applicant: DB HITEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: DB HITEK CO., LTD.
- Current Assignee: DB HITEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Patterson Thuente Pederson, P.A.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@584036e8
- Main IPC: H04R19/04
- IPC: H04R19/04 ; B81B3/00 ; B81C1/00 ; H04R19/00 ; H04R7/18 ; H04R31/00 ; H04R7/04

Abstract:
A MEMS microphone includes a substrate having a cavity, a back plate being disposed over the substrate and having a plurality of acoustic holes, a diaphragm disposed between the substrate and the back plate, the diaphragm being spaced apart from the substrate and the back plate, covering the cavity to form an air gap between the back plate, and being configured to generate a displacement in response to an acoustic pressure and a plurality of anchors extending from an end portion of the diaphragm to be integrally formed with the diaphragm, the anchors being arranged along a circumference of the diaphragm to be spaced apart from each other, and having lower surfaces making contact with an upper surface of the substrate to support the diaphragm. Thus, the MEMS microphone may have improved rigidity and flexibility.
Public/Granted literature
- US20190082271A1 MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-03-14
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