Invention Grant
- Patent Title: Circuit board structure and conductive transmission line structure thereof
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Application No.: US16276619Application Date: 2019-02-15
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Publication No.: US10736209B2Publication Date: 2020-08-04
- Inventor: Sheng-Fan Yang , Yuan-Hung Lin , Yu-Cheng Sun
- Applicant: Global Unichip Corporation , Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu TW Hsinchu
- Assignee: Global Unichip Corporation,Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Global Unichip Corporation,Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu TW Hsinchu
- Agency: JCIPRNET
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3fd05bd2
- Main IPC: H03H7/38
- IPC: H03H7/38 ; H05K1/02 ; H01P3/08

Abstract:
A conductive transmission line structure includes a first conductive transmission line and a second conductive transmission line. A first segment and a second segment of the first conductive transmission line are respectively disposed adjacent to a third segment and a fourth segment of the second conductive transmission line. Line widths of the first segment and the third segment are respectively smaller than line widths of the second segment and the fourth segment. A spacing between the first segment and the third segment is smaller than a spacing between the second segment and the fourth segment. The first segment and the third segment provide a first impedance, and the second segment and the fourth segment provide a second impedance. The first impedance is smaller than the second impedance. The first and the third signal transmission nodes receive a differential signal pair.
Public/Granted literature
- US20200107431A1 CIRCUIT BOARD STRUCTURE AND CONDUCTIVE TRANSMISSION LINE STRUCTURE THEREOF Public/Granted day:2020-04-02
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