Invention Grant
- Patent Title: Printed circuit board having a molded part and method for the production thereof
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Application No.: US14119841Application Date: 2012-05-23
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Publication No.: US10736214B2Publication Date: 2020-08-04
- Inventor: Markus Wölfel
- Applicant: Markus Wölfel
- Applicant Address: DE Eckenthal
- Assignee: JUMATECH GMBH
- Current Assignee: JUMATECH GMBH
- Current Assignee Address: DE Eckenthal
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@73dd8daf
- International Application: PCT/EP2012/002205 WO 20120523
- International Announcement: WO2012/159753 WO 20121129
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/24 ; H01R9/00 ; H05K1/11 ; H05K1/02 ; H05K1/16 ; H05K3/20
Abstract:
A printed circuit board and a method for the production thereof. The printed circuit board can include a shaped part made of an electrically conducting material and can be used to manage the currents and heat volumes that occur in the field of power electronics.
Public/Granted literature
- US20140204553A1 PRINTED CIRCUIT BOARD HAVING A MOLDED PART AND METHOD FOR THE PRODUCTION THEREOF Public/Granted day:2014-07-24
Information query
