A surface mounting component module according to one embodiment of the present invention comprises: a multi-layer substrate; a side via formed by penetrating the multi-layer substrate, and electrically connecting the multi-layer substrate; a side via pad positioned on at least one layer of the multi-layer substrate, and formed in the vicinity of the side via; and an RF pattern connected to the side via pad by a signal line, wherein all of the RF pattern, the side via, and the side via pad are electrically connected.