Invention Grant
- Patent Title: Temperature based pressure sensing and airflow control
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Application No.: US15872596Application Date: 2018-01-16
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Publication No.: US10736241B1Publication Date: 2020-08-04
- Inventor: Alan Joseph Lachapelle , Matthew Gangemi , Vikneshan Sundaralingam , Suresh Soundararaj
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G05B15/02

Abstract:
A cooling system, e.g. for a hot aisle/cold aisle datacenter system, can detect local pressure differences between the hot and cold aisle by way of a conduit containing a temperature sensor positioned between the hot aisle and cold aisle. The temperature sensor can detect a temperature of airflow between the aisles by the temperature sensor in the conduit. This conduit is defined by a frame or insert that includes a first opening and a second opening separated by a nonzero distance and that is configured to penetrate a containment element separating the hot aisle and cold aisle. The cooling system can, based on the interstitial temperature, determine a direction of flow of the airflow between the hot region and the cold region and detect recirculation between the hot region and the cold region based on the direction of flow.
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