Invention Grant
- Patent Title: Method of performing a surface treatment on a mounting table, the mounting table and a plasma processing apparatus
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Application No.: US15398337Application Date: 2017-01-04
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Publication No.: US10738374B2Publication Date: 2020-08-11
- Inventor: Shinya Okabe , Hideaki Yamasaki , Junya Oka , Yuuji Kobayashi , Takamichi Kikuchi
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@545982cc
- Main IPC: H01L21/58
- IPC: H01L21/58 ; C23C4/134 ; H01J37/32 ; C23C16/458 ; C23C16/44 ; C23C4/11 ; C23C4/137 ; C23C4/18 ; H01L21/687

Abstract:
There is provided a method of performing a surface treatment with respect to a metal mounting table for mounting a substrate to be plasma-processed, the mounting table functioning as a lower electrode configured to generate a plasma by a high frequency power applied between an upper electrode and the lower electrode. The method includes: performing a first surface treatment by spraying a non-sublimation blast material as a non-sublimation material onto a mounting surface of the metal mounting table on which the substrate is mounted, followed by a second surface treatment by spraying a sublimation blast material as a sublimation material onto the mounting surface.
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Information query
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