Invention Grant
- Patent Title: Substrate holder and plating apparatus using the same
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Application No.: US15589888Application Date: 2017-05-08
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Publication No.: US10738390B2Publication Date: 2020-08-11
- Inventor: Matsutaro Miyamoto
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: BakerHostetler
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2404db96
- Main IPC: C25D17/00
- IPC: C25D17/00 ; C25D17/08 ; C25D7/12 ; C25D17/06 ; H01L21/288 ; H01L21/683

Abstract:
A substrate holder is provided. The substrate holder comprises a first holding member having a support surface supporting a substrate; and a second holding member sandwiching and holding the substrate together with the first holding member. The first holding member comprises a first contact point located along a periphery of the support surface. The second holding member comprises a second contact point configured to contact with the substrate placed on the support surface. The first contact point has a flat plate shape. The second contact point comprises a first end portion contacting with the substrate; and a second end portion contacting with the first contact point. The second end portion is configured to elastically contact with the first contact point when the substrate is held between the first holding member and the second holding member.
Public/Granted literature
- US20170321343A1 SUBSTRATE HOLDER AND PLATING APPARATUS USING THE SAME Public/Granted day:2017-11-09
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