An imprint apparatus, to perform an imprinting process for bringing a mold and an imprint material on a substrate into contact with each other and curing the imprint material, includes a substrate deforming mechanism and a controller. The substrate deforming mechanism deforms the substrate in such a manner that a surface geometry of at least part of the substrate protrudes toward the mold. The controller determines a condition for the imprinting process on a shot area of the substrate based on the surface geometry of the shot area when the mold is brought into contact with the imprint material on the shot area.