Invention Grant
- Patent Title: High data integrity processing system
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Application No.: US15595844Application Date: 2017-05-15
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Publication No.: US10740186B2Publication Date: 2020-08-11
- Inventor: Bruce A. Boettjer , Maryanne Dooley
- Applicant: THE BOEING COMPANY
- Applicant Address: US IL Chicago
- Assignee: THE BOEING COMPANY
- Current Assignee: THE BOEING COMPANY
- Current Assignee Address: US IL Chicago
- Agency: Moore Intellectual Property Law, PLLC
- Main IPC: G06F11/00
- IPC: G06F11/00 ; G06F11/14 ; G06F11/10 ; G06F11/18

Abstract:
Disclosed is a high data integrity processing system (“HDIPS”) that includes a first processing device and a triple voted processing (“TVP”) device in signal communication with the first processing device. The first processing device has a high radiation resistance and includes a processor, a cache memory, and a computer-readable medium (“CRM”). The CRM has encoded thereon computer-executable instructions to cause the processer to execute a periodic first integrity check on the first processing device producing a first integrity result, which is transmitted to the TVP device. The TVP device includes firmware having encoded thereon machine instructions to, simultaneously with the periodic first integrity check, cause the TVP device to execute a second integrity check producing a second integrity result, compare the first integrity result with the second integrity result, and power reset the first processing device if the first integrity result does not match the second integrity result.
Public/Granted literature
- US20180329780A1 High Data Integrity Processing System Public/Granted day:2018-11-15
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