Invention Grant
- Patent Title: Non-uniform bus (NUB) interconnect protocol for tiled last level caches
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Application No.: US15677739Application Date: 2017-08-15
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Publication No.: US10740236B2Publication Date: 2020-08-11
- Inventor: Vikas Sinha , Eric C. Quinnell , Jyotsna Kartha
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR
- Agency: The Farrell Law Firm, P.C.
- Main IPC: G06F15/17
- IPC: G06F15/17 ; G06F12/0831 ; G06F15/76 ; G06F3/06

Abstract:
A method and apparatus are provided. The apparatus includes a plurality of central processing units, a plurality of core input/output units, a plurality of last level cache memory banks, an interconnect network comprising multiple instantiations of dedicated data channels, wherein each dedicated data channel is dedicated to a memory transaction type, each instantiation of dedicated data channels includes arbitration multiplexors, and each dedicated data channel operates independently of other data channels.
Public/Granted literature
- US20180329820A1 NON-UNIFORM BUS (NUB) INTERCONNECT PROTOCOL FOR TILED LAST LEVEL CACHES Public/Granted day:2018-11-15
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