A polymer composite device comprises a first thermoplastic covering layer of a polymer material with a first softening temperature and a second thermoplastic covering layer of a polymer material with a second softening temperature. The polymer composite device also comprises a carrier layer, which is arranged between the first covering layer and the second covering layer. An inner layer, which comprises at least a first thermoplastic inner layer ply of a polymer material with a third softening temperature, is arranged between the first covering layer and the second covering layer. The inner layer at least partially surrounds the carrier layer in a material-bonding manner. The third softening temperature is lower than the first softening temperature and lower than the second softening temperature.