Invention Grant
- Patent Title: Coil component
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Application No.: US15826012Application Date: 2017-11-29
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Publication No.: US10741320B2Publication Date: 2020-08-11
- Inventor: Hwan Soo Lee , Yoon Hee Cho , Sung Min Song
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@25becaa8
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/28 ; H01F27/32 ; H01F27/255 ; H01F17/00

Abstract:
A coil component includes: a coil part including a coil conductor; and a body formed adjacently to the coil part and including first and second magnetic powder particles having different average particle sizes, wherein an average particle size of the first magnetic powder particles is smaller than an interval between adjacent patterns of the coil conductor, and an average particle size of the second magnetic powder particles is greater than the interval between the adjacent patterns of the coil conductor.
Public/Granted literature
- US20190019615A1 COIL COMPONENT Public/Granted day:2019-01-17
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