Invention Grant
- Patent Title: Substrate processing device and substrate processing method
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Application No.: US16320127Application Date: 2017-09-07
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Publication No.: US10741422B2Publication Date: 2020-08-11
- Inventor: Michinori Iwao , Noriyuki Kikumoto , Shuichi Yasuda , Kazuhiro Fujita , Mizuki Osawa , Hiroshi Ebisui
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2fe65112 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5bf4b524
- International Application: PCT/JP2017/032332 WO 20170907
- International Announcement: WO2018/056067 WO 20180329
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B05B14/00 ; B08B3/02 ; H01L21/02 ; H01L21/306
Abstract:
A substrate processing apparatus includes a substrate holder that holds a substrate, a processing liquid piping that is communicatively connected with a discharge port for discharging a processing liquid, a processing liquid supplier that supplies the processing liquid to the processing liquid piping, a suction unit for suctioning the processing liquid present inside the processing liquid piping, and a controller which controls the processing liquid supplying unit and the suction unit. The controller executes a processing liquid supplying step that supplies the processing liquid to the processing liquid piping and a suctioning step that suctions the processing liquid inside the processing liquid piping by the suction unit. The controller selectively executes a first suctioning step and a second suctioning step of the processing liquid.
Public/Granted literature
- US20190262851A1 SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD Public/Granted day:2019-08-29
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