Invention Grant
- Patent Title: Systems and methods for wafer pod alignment
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Application No.: US15883509Application Date: 2018-01-30
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Publication No.: US10741433B2Publication Date: 2020-08-11
- Inventor: Chao-Hsiang Liu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/67 ; H01L21/673 ; B25J9/16 ; B25J11/00

Abstract:
In an embodiment, a wafer pod includes: a cavity configured to receive and store a wafer; an alignment fiducial within the cavity, wherein: the alignment fiducial comprises two lines orthogonal to each other, and the alignment fiducial is configured to be detected by a robotic arm alignment sensor disposed on a robotic arm, wherein the alignment fiducial defines an alignment orientation for a robotic arm gripper hand to enter into the cavity.
Public/Granted literature
- US20190164799A1 SYSTEMS AND METHODS FOR WAFER POD ALIGNMENT Public/Granted day:2019-05-30
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