Invention Grant
- Patent Title: Resin substrate, component-mounting resin substrate, and method of manufacturing component-mounting resin substrate
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Application No.: US15904469Application Date: 2018-02-26
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Publication No.: US10741462B2Publication Date: 2020-08-11
- Inventor: Kuniaki Yosui , Hirofumi Shinagawa , Yuki Ito
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7f18c43f
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/498 ; H01L23/00 ; H01L23/48 ; H05K3/32 ; H05K1/02 ; H01L23/13 ; H05K1/03 ; H05K3/46
Abstract:
A component-mounting resin substrate includes a resin substrate and a component. The resin substrate includes a thermoplastic resin body. The component is mounted on the resin substrate by ultrasonic bonding. In a mounting area of the resin body in which the component is mounted, a cavity that is hollowed from a mounting surface on which the component is mounted is defined. A plating layer that includes a material harder than the resin body is disposed on at least a portion of a wall surface of the cavity.
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Information query
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