Invention Grant
- Patent Title: Circuit module and method of manufacturing the same
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Application No.: US16451825Application Date: 2019-06-25
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Publication No.: US10741465B2Publication Date: 2020-08-11
- Inventor: Katsuhiko Fujikawa , Shingo Funakawa , Kazushige Sato , Nobumitsu Amachi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@66eeb6f7
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/29 ; H01L23/36 ; H01L23/495 ; H01L25/065 ; H05K3/36 ; H01L23/373 ; H01L23/433
Abstract:
A circuit module (301) includes a first substrate (201), a first module (101), a sealing resin portion (3), and a conductive material film (7). The first substrate (201) has a first principal surface (201a). The first module (101) is mounted on the first principal surface (201a). The sealing resin portion (3) is formed on the first principal surface (201a) and covers the first module (101). The conductive material film (7) covers a side of the sealing resin portion (3). The first module (101) includes a conductive material portion and a device which may produce heat and which is mounted on the conductive material portion. The conductive material portion connects with the conductive material film (7) on the side of the sealing resin portion (3).
Public/Granted literature
- US20190318974A1 CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-10-17
Information query
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