Invention Grant
- Patent Title: Component module and power module
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Application No.: US15750150Application Date: 2016-08-02
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Publication No.: US10741474B2Publication Date: 2020-08-11
- Inventor: Stefan Stegmeier
- Applicant: SIEMENS AKTIENGESELLSCHAFT
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Agency: Lempia Summerfield Katz LLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6d146361
- International Application: PCT/EP2016/068394 WO 20160802
- International Announcement: WO2017/021394 WO 20170209
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H01L23/467 ; H01L23/373 ; H01L23/00

Abstract:
The disclosed component module includes a component comprising at least one electric contact to which at least one porous contact piece is connected; the component module further includes a cooling system for fluid-based cooling, said cooling system comprising one or more cooling ducts which are formed by pores of the porous contact piece. The disclosed power module comprises a component module of said type.
Public/Granted literature
- US20180301392A1 COMPONENT MODULE AND POWER MODULE Public/Granted day:2018-10-18
Information query
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