Invention Grant
- Patent Title: Power module and method of manufacturing the same, and power electronic apparatus and method of manufacturing the same
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Application No.: US16079638Application Date: 2017-02-07
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Publication No.: US10741478B2Publication Date: 2020-08-11
- Inventor: Shinnosuke Soda , Hiroshi Kobayashi
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Chiyoda-ku
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1cc8a0f3
- International Application: PCT/JP2017/004372 WO 20170207
- International Announcement: WO2017/169134 WO 20171005
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/07 ; H01L25/18 ; H01L23/495 ; H01L23/00
Abstract:
A power module includes a first power semiconductor device including a first electrode, a resin frame including first receiving portions, and a first leadframe. The first leadframe has a first main surface facing the first electrode and is electrically and mechanically connected to the first electrode. The first receiving portions face the first main surface of the first leadframe and receive part of the first leadframe. Thus, the power module has high reliability and can be miniaturized.
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Information query
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