A semiconductor package assembly has a leadframe that includes a socket member into which solderless pins may be inserted as interconnects to an external component. The cost of manufacturing such a leadframe is reduced without sacrificing the ability to make solderless connections with external components such as PCBs. For example, instead of using a hard material that requires two stamping tools, the leadframes with female sockets may be made using softer copper-based materials. Moreover, the width of such leadframes is significantly smaller than the width of a leadframe with the press-fit pins included. Such a reduced width may further reduce manufacturing costs.