A multi-chip module includes a first semiconductor component including a first set of connections having a first pitch dimension and at least a second set of connections having a second pitch dimension, wherein the first pitch dimension is smaller than the second pitch dimension. The multi-chip module further includes a second semiconductor component interconnected with the first set of connections of the first semiconductor component. The multi-chip module further includes at least a third semiconductor component interconnected with the second set of connections of the first semiconductor component and wherein a surface of the third semiconductor component is adhered to a surface of the second semiconductor component, wherein the surfaces at least partially overlap one another.