- Patent Title: FINFET device integrated with TFET and manufacturing method thereof
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Application No.: US16465200Application Date: 2017-11-22
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Publication No.: US10741549B2Publication Date: 2020-08-11
- Inventor: Deming Sun
- Applicant: SHANGHAI IC R&D CENTER CO., LTD. , CHENGDU IMAGE DESIGN TECHNOLOGY CO. LTD.
- Applicant Address: CN Shanghai CN Chengdu
- Assignee: SHANGHAI IC R&D CENTER CO., LTD,CHENGDU IMAGE DESIGN TECHNOLOGY CO., LTD.
- Current Assignee: SHANGHAI IC R&D CENTER CO., LTD,CHENGDU IMAGE DESIGN TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shanghai CN Chengdu
- Agency: Tianchen LLC
- Agent Yuan R. Li; Yi Fan Yin
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6716e7ec
- International Application: PCT/CN2017/112354 WO 20171122
- International Announcement: WO2018/099306 WO 20180607
- Main IPC: H01L27/07
- IPC: H01L27/07 ; H01L21/266 ; H01L21/8234 ; H01L29/739 ; H01L29/78

Abstract:
The present disclosure provides a FINFET device integrated with a TFET and its manufacturing method. Two end portions of the fin structure respectively form an N-type doped drain and a source which is consisted by a top P-type doped region and a bottom N-type doped region. As a result, the bottom N-type doped region of the source, the drain, the channel, the high-k dielectric layer and the gate structure on the surface of the sidewall of the fin structure form a MOS FINFET device, and the top P-type doped region of the source, the drain, the channel, the high-k dielectric layer and the gate structure on the top surface of the fin structure form the TFET device. The integration of the TFET and the FINFET is achieved, which decreases the cost.
Public/Granted literature
- US20200006326A1 FINFET DEVICE INTEGRATED WITH TFET AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-01-02
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