Invention Grant
- Patent Title: Metal gate modulation to improve kink effect
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Application No.: US16574205Application Date: 2019-09-18
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Publication No.: US10741555B2Publication Date: 2020-08-11
- Inventor: Meng-Han Lin , Te-Hsin Chiu , Wei Cheng Wu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L27/092 ; H01L29/49 ; H01L29/423 ; H01L29/78 ; H01L21/8238 ; H01L29/66 ; H01L21/28 ; H01L21/762 ; H01L29/40 ; H01L29/51

Abstract:
The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip has a source region and a drain region. The drain region is separated from the source region by a channel region. An isolation structure surrounds the source region, the drain region, and the channel region. A gate structure is over the channel region. The gate structure includes a first gate electrode region having one or more first materials and a second gate electrode region having one or more second materials that are different than the one or more first materials. The second gate electrode region continuously extends between a first outermost sidewall directly over the isolation structure and a second outermost sidewall directly over the channel region.
Public/Granted literature
- US20200013778A1 METAL GATE MODULATION TO IMPROVE KINK EFFECT Public/Granted day:2020-01-09
Information query
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