• Patent Title: Image sensor, imaging apparatus, and method of manufacturing image sensor
  • Application No.: US15551229
    Application Date: 2016-02-26
  • Publication No.: US10741597B2
    Publication Date: 2020-08-11
  • Inventor: Takashi Nakashikiryo
  • Applicant: KYOCERA Corporation
  • Applicant Address: JP Kyoto
  • Assignee: Kyocera Corporation
  • Current Assignee: Kyocera Corporation
  • Current Assignee Address: JP Kyoto
  • Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@45ccd0cd com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4b2f7837 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7f551db1
  • International Application: PCT/JP2016/001057 WO 20160226
  • International Announcement: WO2016/136274 WO 20160901
  • Main IPC: H01L35/32
  • IPC: H01L35/32 H01L27/146
Image sensor, imaging apparatus, and method of manufacturing image sensor
Abstract:
An image sensor, an imaging apparatus, and a method of manufacturing an image sensor with an improved heat dissipation effect. An image sensor includes a first layer having an imaging function, pixels being arranged in the first layer in at least a first direction, and a second layer joined to the first layer. The second layer includes a first sublayer, and primary material regions including primary material and secondary material regions including secondary material are arranged alternately in the first direction in the first sublayer.
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