Invention Grant
- Patent Title: IGBT with improved terminal and manufacturing method thereof
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Application No.: US15892249Application Date: 2018-02-08
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Publication No.: US10741651B2Publication Date: 2020-08-11
- Inventor: Jian Liu
- Applicant: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION , SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- Applicant Address: CN Shanghai CN Beijing
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION,SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION,SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- Current Assignee Address: CN Shanghai CN Beijing
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@17786821
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/739 ; H01L49/02 ; H01L29/66 ; H01L27/06 ; H01L29/06

Abstract:
A terminal structure of an insulated gate bipolar transistor (IGBT) device includes a main junction, a cutoff ring, and a plurality of terminal rings disposed between the main junction and the cutoff ring, and a resistive element having a first terminal electrically connected to the main junction, a second terminal electrically connected to the cutoff ring, and a plurality of intermediate terminals electrically connected to the terminal rings, respectively. The resistive element is configured to uniformly distribute the lateral voltage between the main junction and the cutoff ring to the terminal rings to ensure that the peak electric field is uniformly distributed across the terminal structure, thereby reducing the terminal structure area and package cost of the IGBT device, while improving the device reliability.
Public/Granted literature
- US20180240880A1 IGBT WITH IMPROVED TERMINAL AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-08-23
Information query
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