Invention Grant
- Patent Title: Encapsulation layer for vertical transport field-effect transistor gate stack
-
Application No.: US16374732Application Date: 2019-04-03
-
Publication No.: US10741663B1Publication Date: 2020-08-11
- Inventor: Ruqiang Bao , Hemanth Jagannathan , Michael P. Belyansky
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Otterstedt, Wallace & Kammer, LLP
- Agent Vazken Alexanian
- Main IPC: H01L29/51
- IPC: H01L29/51 ; H01L29/66 ; H01L29/78 ; H01L29/16 ; H01L27/092 ; H01L21/28 ; H01L21/8238

Abstract:
A vertical transport field-effect transistor includes gate metal protected by a conformal encapsulation layer. Techniques for fabricating the transistor include depositing the conformal encapsulation layer over the gate metal prior to depositing an additional encapsulation layer such as a nitride layer. The conformal encapsulation layer protects the gate metal during deposition of the additional encapsulation layer, thereby avoiding oxidation or nitridation of the gate metal. The conformal encapsulation layer may be an amorphous silicon layer deposited at relatively low temperature.
Information query
IPC分类: