Invention Grant
- Patent Title: Gate structure for semiconductor device
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Application No.: US16204849Application Date: 2018-11-29
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Publication No.: US10741672B2Publication Date: 2020-08-11
- Inventor: Kuo-Cheng Ching , Chih-Hao Wang , Ching-Wei Tsai , Kuan-Lun Cheng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co. Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co. Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/45 ; H01L21/3065 ; H01L21/02 ; H01L21/28 ; H01L29/423 ; H01L21/3213 ; H01L21/321

Abstract:
A method of forming a fin field effect transistors (finFET) on a substrate includes forming a fin structure on the substrate, forming a protective layer on the fin structure, and forming a polysilicon structure on the protective layer. The method further includes modifying the polysilicon structure such that a first horizontal dimension of a first portion of the modified polysilicon structure is smaller than a second horizontal dimension of a second portion of the modified polysilicon structure. The method further includes replacing the modified polysilicon structure with a gate structure having a first horizontal dimension of a first portion of the gate structure that is smaller than a second horizontal dimension of a second portion of the gate structure.
Public/Granted literature
- US20190172926A1 GATE STRUCTURE FOR SEMICONDUCTOR DEVICE Public/Granted day:2019-06-06
Information query
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