Invention Grant
- Patent Title: Selective silicon growth for gapfill improvement
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Application No.: US16740999Application Date: 2020-01-13
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Publication No.: US10741674B2Publication Date: 2020-08-11
- Inventor: De-Wei Yu , Chien-Hao Chen , Pin-Ju Liang , I-Chen Yang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: C23C16/24
- IPC: C23C16/24 ; C23C16/56 ; H01L21/02 ; H01L21/285 ; C23C16/455 ; H01L29/66

Abstract:
Embodiments disclosed herein relate generally to forming a gate layer in high aspect ratio trenches using a cyclic deposition-treatment process. In an embodiment, a method includes subjecting a substrate surface having at least one feature to a film deposition process to form a conformal film over a bottom surface and along sidewall surfaces of the feature, subjecting the substrate surface to a treatment process to form respective halogen surface layers or respective halogen-terminated layers on the conformal film formed at respective upper portions of the sidewall surfaces, and performing sequentially and repeatedly the film deposition process and the treatment process to fill the feature with the film.
Public/Granted literature
- US20200152771A1 Selective Silicon Growth for Gapfill Improvement Public/Granted day:2020-05-14
Information query
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