Invention Grant
- Patent Title: Semiconductor device and method for manufacturing same
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Application No.: US15918652Application Date: 2018-03-12
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Publication No.: US10741683B2Publication Date: 2020-08-11
- Inventor: Shin Harada , Makoto Sasaki , Taro Nishiguchi , Kyoko Okita , Keiji Wada , Tomihito Miyazaki
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Baker Botts L.L.P.
- Agent Michael A. Sartori
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@62f3a211
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/02 ; H01L21/20 ; H01L29/04 ; H01L29/66 ; H01L29/739 ; H01L29/16

Abstract:
A semiconductor device has a semiconductor layer and a substrate. The semiconductor layer constitutes at least a part of a current path, and is made of silicon carbide. The substrate has a first surface supporting the semiconductor layer, and a second surface opposite to the first surface. Further, the substrate is made of silicon carbide having a 4H type single-crystal structure. Further, the substrate has a physical property in which a ratio of a peak strength in a wavelength of around 500 nm to a peak strength in a wavelength of around 390 nm is 0.1 or smaller in photoluminescence measurement. In this way, the semiconductor device is obtained to have a low on-resistance.
Public/Granted literature
- US20180204942A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2018-07-19
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