Invention Grant
- Patent Title: Heater module
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Application No.: US15792918Application Date: 2017-10-25
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Publication No.: US10741807B2Publication Date: 2020-08-11
- Inventor: Shinji Wada , Masanori Matsuda , Yoshikazu Kenmoku
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Paratus Law Group, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3d598cc3
- Main IPC: H01M2/10
- IPC: H01M2/10 ; H01M10/6554 ; H01M10/615 ; H01M10/625 ; H01M10/64 ; H01M10/6555 ; H01M10/657 ; H01M2/20

Abstract:
A heater module is configured to be arranged on a side surface of a battery module and includes: a heat equalizing plate; a heater, a heater cover; and a metal stay in this order from the side surface of the battery module. The heater is fixed on the heat equalizing plate, the heater cover includes a heat equalizing plate holding portion and a stay holding portion, the metal stay includes: fastening portions provided on both end portions thereof in a stacking direction of cells and configured to be fastened to the side surface of the battery module; and a bent portion configured to cover a lower surface of the heater cover, and the bent portion of the metal stay is arranged at a location overlapping with the heat equalizing plate holding portion of the heater cover in the stacking direction.
Public/Granted literature
- US20180114962A1 HEATER MODULE Public/Granted day:2018-04-26
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