- Patent Title: Multi-layered software defined antenna and method of manufacture
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Application No.: US16708354Application Date: 2019-12-09
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Publication No.: US10741921B2Publication Date: 2020-08-11
- Inventor: Dedi David Haziza
- Applicant: Wafer LLC
- Applicant Address: US NH Hanover
- Assignee: Wafer LLC
- Current Assignee: Wafer LLC
- Current Assignee Address: US NH Hanover
- Agency: Womble Bond Dickinson (US) LLP
- Agent Joseph Bach, Esq.
- Main IPC: H01Q1/48
- IPC: H01Q1/48 ; H01Q9/04 ; H01Q21/28 ; H01Q21/06 ; H01Q21/24 ; H01L23/66 ; H01Q1/50 ; H01Q3/36 ; H04B7/0413 ; H04B7/08 ; H04L27/18 ; H01Q3/24 ; H01Q9/14

Abstract:
A multi-layer software controlled antenna. A radiating patch is provided over a variable dielectric constant (VDC) plate. Variable DC potential is applied across the VDC plate to control the effective dielectric constant at various locations of the VDC plate. RF signal is coupled between a feed patch and a delay line, and the delay line couples the RF signal to the radiating patch. The radiating patch, VDC plate, delay line, and feed patch are each provided at a different layer of the antenna, so as to decouple the RF and DC signal paths. A controller executes a software program to thereby control the variable DC potential applied across the VDC plate, thereby controlling the operational characteristics of the antenna.
Public/Granted literature
- US20200112102A1 MULTI-LAYERED SOFTWARE DEFINED ANTENNA AND METHOD OF MANUFACTURE Public/Granted day:2020-04-09
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