Invention Grant
- Patent Title: Connector equipped with spring retention mechanism
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Application No.: US16260137Application Date: 2019-01-29
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Publication No.: US10741952B2Publication Date: 2020-08-11
- Inventor: Heng-Kang Wu , Fu-Jin Peng
- Applicant: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD. , FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Applicant Address: CN Kunshan KY Grand Cayman
- Assignee: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.,FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Current Assignee: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.,FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Current Assignee Address: CN Kunshan KY Grand Cayman
- Agent Wei Te Chung; Ming Chieh Chang
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@e84d0ee
- Main IPC: H01L23/40
- IPC: H01L23/40 ; H01R12/88 ; H01R12/71 ; H05K7/10 ; H01R12/70

Abstract:
The electrical connector is equipped with a retention mechanism for securing mounting a heat sink upon a CPU which is received within an insulative housing of the connector. The retention mechanism includes a pair of seats, a pair of towers fixed to the pair of seats, respectively, a pressing device retained between the pair of towers in a deformable manner. The pressing device is intimately seated upon the heat sink to significantly press the heat sink against the CPU when the pressing device is deformed in a tensional status.
Public/Granted literature
- US20190252813A1 CONNECTOR EQUIPPED WITH SPRING RETENTION MECHANISM Public/Granted day:2019-08-15
Information query
IPC分类: