Invention Grant
- Patent Title: Wire pass through device
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Application No.: US16143935Application Date: 2018-09-27
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Publication No.: US10742013B2Publication Date: 2020-08-11
- Inventor: Kevin O'Connor , Mike Brown
- Applicant: Manufacturing Resources International, Inc.
- Applicant Address: US GA Alpharetta
- Assignee: Manufacturing Resources International, Inc.
- Current Assignee: Manufacturing Resources International, Inc.
- Current Assignee Address: US GA Alpharetta
- Agency: Standley Law Group LLP
- Agent Jeffrey S. Standley; Adam J. Smith
- Main IPC: H02G15/013
- IPC: H02G15/013 ; F16J15/02 ; H02G3/02 ; H02G3/22 ; H02G3/08

Abstract:
A device for sealing an interface is provided. The device includes an opening for a wire to pass through the interface. A first sealing block includes a body and a first portion that extends outwardly therefrom. A concave recess is formed between two points and is sized to surround at least a first portion of the wire. A second sealing block has a body portion with a recess extending inwardly therein and is sized to surround at least a second portion of the wire. The first sealing block and the second sealing block are configured to mate with one another to provide a substantially sealed passage for the wire.
Public/Granted literature
- US20190027915A1 WIRE PASS THROUGH DEVICE Public/Granted day:2019-01-24
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