A circuit module includes a substrate on first and second surfaces of which electronic components are mounted, sealing resins with which at least the electronic components are sealed on the first and second surfaces of the substrate, and a terminal-use circuit component at both ends of which electrodes are provided, one of the electrodes being joined by a conductive joining member to one of the first and second surfaces of the substrate such that an axis connecting centers of the electrodes at the both ends is perpendicular or substantially perpendicular to the substrate and another of the electrodes is exposed at a surface of the sealing resin, and the terminal-use circuit component includes a void at which the conductive joining member is not disposed, at a center portion of the one of the electrodes on a side coupled to the substrate.