Invention Grant
- Patent Title: Embedding a component in a core on conductive foil
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Application No.: US15716788Application Date: 2017-09-27
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Publication No.: US10743422B2Publication Date: 2020-08-11
- Inventor: Armin Wiedenhofer
- Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Applicant Address: AT Leoben
- Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee Address: AT Leoben
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@a66685b
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K1/18 ; H05K3/46 ; H05K1/03 ; H05K1/09 ; H05K3/40 ; H05K3/00
Abstract:
A method of embedding a component in a component carrier, wherein the method comprises providing a cured core with a recess on an electrically conductive foil, and mounting the component in the recess on the foil.
Public/Granted literature
- US20180092220A1 Embedding a Component in a Core on Conductive Foil Public/Granted day:2018-03-29
Information query
