A wire cleaning apparatus and method is provided, in which a wire cleaning apparatus includes a passive brush mechanism comprising a helical brush, the helical structure having a helical axis substantially coincident with path of a wire passing through the wire cleaning apparatus. The helical brush includes a plurality of first bristles generally oriented inwardly from the helical structure toward the wire, and the helical brush may be compressed or extended to adjust the inner diameter of the helical brush. The wire cleaning apparatus further comprises an active brush mechanism disposed around the wire and configured to rotate around the wire. The active brush mechanism comprises at least one cylindrical brush having a plurality of second bristles disposed on a cylindrical surface such that one or more of the plurality of second bristles impinge upon the wire. The at least one cylindrical brush having a cylindrical axis about which the at least one cylindrical brush is configured to rotate relative to the active brush mechanism.