Invention Grant
- Patent Title: Filler for heat transfer member and heat transfer member
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Application No.: US16150920Application Date: 2018-10-03
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Publication No.: US10745561B2Publication Date: 2020-08-18
- Inventor: Koji Nakanishi
- Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Applicant Address: JP Toyota-shi, Aichi-ken
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Toyota-shi, Aichi-ken
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@556e3970
- Main IPC: C08J5/10
- IPC: C08J5/10 ; C08K9/02 ; C08L83/04 ; C08J9/00 ; C08L75/04 ; C08L21/00 ; C08L27/12 ; C08K3/08 ; C08K3/38

Abstract:
A filler for a heat transfer member includes: a core material which is made of an inorganic material or metal material having a thermal conductivity of 15 W/mK or more, and transfers heat; and an insulating film which includes a silicon oxide film and a diamond-like carbon film having electrical insulation properties, and covers the core material. The dielectric breakdown voltage of the filler is 500 V or more.
Public/Granted literature
- US20190106572A1 FILLER FOR HEAT TRANSFER MEMBER AND HEAT TRANSFER MEMBER Public/Granted day:2019-04-11
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