- Patent Title: Chemical mechanical polishing (CMP) of cobalt-containing substrate
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Application No.: US15615236Application Date: 2017-06-06
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Publication No.: US10745589B2Publication Date: 2020-08-18
- Inventor: Xiaobo Shi , Joseph Rose , Timothy Joseph Clore , James Allen Schlueter , Malcolm Grief , Mark Leonard O'Neill
- Applicant: Versum Materials US, LLC
- Applicant Address: US AZ Tempe
- Assignee: Versum Materials US, LLC
- Current Assignee: Versum Materials US, LLC
- Current Assignee Address: US AZ Tempe
- Agent Lina Yang
- Main IPC: C09G1/02
- IPC: C09G1/02 ; B24B37/04 ; C09K3/14 ; C23F3/04 ; H01L21/321 ; H01L21/768
Abstract:
Chemical mechanical polishing (CMP) compositions, methods and systems for polish cobalt or cobalt-containing substrates are provided. The CMP compositions comprise α-alanine, abrasive particles, a salt of phosphate, corrosion inhibitor, oxidizer and water. The cobalt chemical mechanical polishing compositions provide high removal rate of Co as well as very high selectivity of Co film vs. dielectric film, such as TEOS, SixNy (with 1.0
Public/Granted literature
- US20170362466A1 Chemical Mechanical Polishing (CMP) of Cobalt-Containing substrate Public/Granted day:2017-12-21
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