Invention Grant
- Patent Title: Method for adhesively bonding substrates using adhesives
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Application No.: US15562636Application Date: 2016-04-07
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Publication No.: US10745591B2Publication Date: 2020-08-18
- Inventor: Jörg Tillack , Dirk Achten , Wolfgang Arndt , Roland Wagner , Martin Melchiors , Cornelia Steck
- Applicant: Covestro Deutschland AG
- Applicant Address: DE Leverkusen
- Assignee: Covestro Deutschland AG
- Current Assignee: Covestro Deutschland AG
- Current Assignee Address: DE Leverkusen
- Agent Richard P. Bender
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@17c2fc72
- International Application: PCT/EP2016/057571 WO 20160407
- International Announcement: WO2016/162394 WO 20161013
- Main IPC: C09J5/02
- IPC: C09J5/02 ; C09J5/04 ; C09J5/06 ; A43D25/20 ; A43B9/12 ; B32B7/12 ; B32B27/30 ; C08G18/08 ; C08G18/28 ; C08G18/62 ; C08G18/70 ; C08G18/79 ; C08G18/80

Abstract:
The present invention relates to a method for adhesively bonding substrates, said method comprising the following steps: I) at least one adhesive component (a) and at least one isocyanate component (b) are applied between at least two substrates; II) the substrates are pressed together. The method is characterized in that in step I), the adhesive component and the isocyanate component are applied separately to the substrate. The invention further relates to a composite obtained according to said method. In a preferred embodiment, an aqueous polyurethane dispersion or a polyurethane solution in organic solvents is used as the adhesive component.
Public/Granted literature
- US20180105722A1 METHOD FOR ADHESIVELY BONDING SUBSTRATES USING ADHESIVES Public/Granted day:2018-04-19
Information query
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