- Patent Title: Resin composition, adhesive layer, and circuit board utilizing same
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Application No.: US16021222Application Date: 2018-06-28
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Publication No.: US10745595B2Publication Date: 2020-08-18
- Inventor: Fu-Yun Shen , Cong Lei , Ming-Jaan Ho , Hsiao-Ting Hsu
- Applicant: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD , Avary Holding (Shenzhen) Co., Limited.
- Applicant Address: CN Huai an CN Shenzhen
- Assignee: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD,Avary Holding (Shenzhen) Co., Limited.
- Current Assignee: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD,Avary Holding (Shenzhen) Co., Limited.
- Current Assignee Address: CN Huai an CN Shenzhen
- Agency: ScienBiziP, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@293fed7d
- Main IPC: C09J109/06
- IPC: C09J109/06 ; C08K3/28 ; C08K3/36 ; C08F210/02 ; C08F212/08 ; C08F236/06 ; C08K5/00
Abstract:
A resin having thermal conductivity comprises a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight, a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight, a polyphenylene ether in 3 to 35 parts by weight; and a dendritic acrylate oligomer in 3 to 45 parts by weight. An adhesive layer and a circuit board using the resin composition are also described.
Public/Granted literature
- US20190330500A1 RESIN COMPOSITION, ADHESIVE LAYER, AND CIRCUIT BOARD UTILIZING SAME Public/Granted day:2019-10-31
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