Invention Grant
- Patent Title: Thermosoftening and heat conductive silicone grease composition, heat conductive film formation method, heat dissipation structure, and power module device
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Application No.: US15763004Application Date: 2016-09-12
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Publication No.: US10745603B2Publication Date: 2020-08-18
- Inventor: Kunihiro Yamada
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@46e8adce
- International Application: PCT/JP2016/076766 WO 20160912
- International Announcement: WO2017/051738 WO 20170330
- Main IPC: C08L83/04
- IPC: C08L83/04 ; C09K5/06 ; H01L23/373 ; C08K3/00 ; C08L91/06 ; C08K5/01 ; C09K5/14 ; H05K7/20 ; H01L23/36 ; C08L83/06 ; C08L83/08

Abstract:
A thermosoftening and heat conductive silicone grease composition including: (A) a silicone wax having a melting point of 30-80° C.; (B) a organopolysiloxane indicated by formula R1aSiO(4-a)/2 (R1 indicating a monovalent hydrocarbon group and a being 1.8≤a≤2.2) and having a kinematic viscosity of 10-500,000 mm2/s at 25° C.; and (C) a heat conductive filler material having a heat conductivity of at least 10 W/(m·K).
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