Invention Grant
- Patent Title: Copper alloy sheet material
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Application No.: US15760693Application Date: 2016-08-29
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Publication No.: US10745787B2Publication Date: 2020-08-18
- Inventor: Tsuyoshi Ito , Kuniaki Miyagi , Hiroto Narieda , Tomotsugu Aoyama , Akira Sugawara
- Applicant: DOWA METALTECH CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: DOWA METALTECH CO., LTD.
- Current Assignee: DOWA METALTECH CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Clark & Brody LP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3dfd3e9b
- International Application: PCT/JP2016/075246 WO 20160829
- International Announcement: WO2017/047368 WO 20170323
- Main IPC: C22F1/08
- IPC: C22F1/08 ; C22C9/00 ; C22C9/02 ; H01B1/02 ; H01B13/00 ; H01B5/02 ; C22F1/00 ; C22C9/04

Abstract:
A copper alloy sheet material has a copper alloy component system that has a high conductivity of 75.0% IACS or more and has both high strength and good stress relaxation resistance characteristics. A copper alloy sheet material has a composition containing, by mass %, from 0.01 to 0.50% of Zr, from 0.01 to 0.50% of Sn, a total content of from 0 to 0.50% of Mg, Al, Si, P, Ti, Cr, Mn, Co, Ni, Zn, Fe, Ag, Ca, and B, with the balance Cu, and unavoidable impurities, and a metal structure having a number density NA Of fine second phase particles having a particle diameter of approximately from 5 to 50 nm of 10.0 per 0.12 mm2 or more and a ratio NB/NA of a number density NB (per 0.012 mm2) of coarse second phase particles having a particle diameter exceeding approximately 0.2 mm and the NA of 0.50 or less.
Public/Granted literature
- US20180274074A1 COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING SAME Public/Granted day:2018-09-27
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