Invention Grant
- Patent Title: Clothes treatment apparatus having a heat pump module
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Application No.: US16115825Application Date: 2018-08-29
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Publication No.: US10745854B2Publication Date: 2020-08-18
- Inventor: Myoungjong Kim , Seongwoo An , Sangho Cho
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4a3d30c1
- Main IPC: D06F58/20
- IPC: D06F58/20 ; D06F39/12 ; D06F25/00 ; D06F37/22 ; D06F39/04 ; D06F34/28
Abstract:
Provided is a garment processing apparatus for compactly optimizing the arrangement space of a heat pump system. A heat pump module is modularized by integrally mounting a compressor, a condenser, and an evaporator in an integrated housing and is disposed at an upper portion of a tub.
Public/Granted literature
- US20180371680A1 CLOTHES TREATMENT APPARATUS HAVING A HEAT PUMP MODULE Public/Granted day:2018-12-27
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