Invention Grant
- Patent Title: Fan module
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Application No.: US16019520Application Date: 2018-06-26
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Publication No.: US10746190B2Publication Date: 2020-08-18
- Inventor: Chia-Chen Chen , Chi-Zen Peng , Chia-Ju Ho , Meng-Lung Chiang
- Applicant: Inventec (Pudong) Technology Corporation , INVENTEC CORPORATION
- Applicant Address: CN Shanghai TW Taipei
- Assignee: Inventec (Pudong) Technology Corporation,INVENTEC CORPORATION
- Current Assignee: Inventec (Pudong) Technology Corporation,INVENTEC CORPORATION
- Current Assignee Address: CN Shanghai TW Taipei
- Agency: CKC & Partners Co., LLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6460b677
- Main IPC: F04D29/42
- IPC: F04D29/42 ; F04D29/056 ; H05K7/20 ; F04D29/28 ; F04D29/053 ; G06F1/20 ; F04D25/06 ; F04D29/66

Abstract:
A fan module includes a housing, a bearing, a rotating shaft, and a fan wheel. The housing includes a bottom covering plate, a top covering plate, and a side wall connected between the bottom covering plate and the top covering plate and surrounding to form a housing space. The bearing is disposed on the bottom covering plate and includes a supporting pillar. The supporting pillar extends from the bottom covering plate toward the top covering plate. The rotating shaft has a first through hole therein. The rotating shaft is rotatably sleeved onto the supporting pillar by the first through hole. The fan wheel is connected to an outer edge of the rotating shaft.
Public/Granted literature
- US20190107115A1 FAN MODULE Public/Granted day:2019-04-11
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