Invention Grant
- Patent Title: Fiber-to-waveguide coupling with high alignment tolerance
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Application No.: US15883367Application Date: 2018-01-30
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Publication No.: US10746935B2Publication Date: 2020-08-18
- Inventor: Michal Lipson , You-Chia Chang , Oscar Adrian Jimenez Gordillo , Mohammad Amin Tadayon , Brian Stern
- Applicant: The Trustees of Columbia University in the City of New York
- Applicant Address: US NY New York
- Assignee: The Trustees of Columbia University in the City of New York
- Current Assignee: The Trustees of Columbia University in the City of New York
- Current Assignee Address: US NY New York
- Agency: BakerHostetler
- Main IPC: G02B6/122
- IPC: G02B6/122 ; G02B6/30
Abstract:
An optical coupling apparatus comprising a substrate having a trench formed therein, the trench having a width measured between two opposing walls that define a portion of the trench; and a waveguide disposed on or in the substrate, the waveguide having a width that tapers along an axis of light propagation.
Public/Granted literature
- US20200225413A1 FIBER-TO-WAVEGUIDE COUPLING WITH HIGH ALIGNMENT TOLERANCE Public/Granted day:2020-07-16
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