Invention Grant
- Patent Title: Integrated circuit chip
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Application No.: US16127845Application Date: 2018-09-11
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Publication No.: US10748601B2Publication Date: 2020-08-18
- Inventor: Ji-Hwan Kim , Heat-Bit Park
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3403bb40
- Main IPC: G11C7/10
- IPC: G11C7/10 ; G11C11/4096 ; G11C5/06 ; G11C29/36 ; G11C29/02 ; G11C5/02 ; G11C29/12

Abstract:
An integrated circuit chip includes: one or more couplers suitable for transferring data between stacked chips; one or more data nodes suitable for transferring data to a host; and one or more transfer circuits on a transfer path for transferring data between the one or more couplers and the one or more data nodes, wherein at least one transfer circuit among the one or more transfer circuits inverts a portion of the data which is transferred by the at least one transfer circuit.
Public/Granted literature
- US20190198089A1 INTEGRATED CIRCUIT CHIP Public/Granted day:2019-06-27
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