Invention Grant
- Patent Title: Electronic passive component, method for manufacturing electronic passive component, and apparatus for manufacturing electronic passive component
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Application No.: US15713380Application Date: 2017-09-22
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Publication No.: US10748696B2Publication Date: 2020-08-18
- Inventor: Yuji Shibuya , Kazuhiko Otsuka , Tetsuya Oga
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Law Office of Katsuhiro Arai
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@494d814a
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F41/02 ; H01F27/255 ; H01F27/28 ; H01F27/00 ; H01F17/04
Abstract:
An electronic component includes a member with marking having at least one marking area to be processed digitally, as well as a member other than the member with marking. The marking allows for tracing the production history of individual electronic components.
Public/Granted literature
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